Wenbo Pang

9PUBLICATIONS
34CO-AUTHORS
Micro-manipulationCircuits and systemsEngineering electromagneticsMicroelectronicsElectrical energy transmission, networks and systems
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Publications (9)

|Sep 10, 2025
Rational assembly of 3D network materials and electronics through tensile buckling.

Xiaonan Hu, Zhi Liu, Zhenjia Tang

|Dec 18, 2024
An agile multimodal microrobot with architected passively morphing wheels.

Yuchen Lai, Chuanqi Zang, Guoquan Luo

|May 30, 2024
A three-dimensionally architected electronic skin mimicking human mechanosensation.

Zhi Liu, Xiaonan Hu, Renheng Bo

|Nov 28, 2022
A soft microrobot with highly deformable 3D actuators for climbing and transitioning complex surfaces.

Wenbo Pang, Shiwei Xu, Jun Wu

|Aug 10, 2022
Assembly of complex 3D structures and electronics on curved surfaces.

Zhaoguo Xue, Tianqi Jin, Shiwei Xu

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