Chengkun Cai

1PUBLICATIONS
6CO-AUTHORS
Photonics, optoelectronics and optical communications
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Publications (1)

|Jul 04, 2025
Ultracompact 3D integrated photonic chip for high-fidelity high-dimensional quantum gates.

Kangrui Wang, Dawei Lyu, Chengkun Cai

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Frequent Collaborators

1 joint publications

Kangrui Wang

1 joint publications

Dawei Lyu

1 joint publications

Tianhao Fu

1 joint publications

Qianke Wang