Hyunseop Lee

3PUBLICATIONS
1CO-AUTHORS
Water treatment processesFunctional materialsMicrofluidics and nanofluidics
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Publications (3)

|Feb 25, 2023
Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes.

Hyunseop Lee

|Sep 11, 2020
Preliminary Study on Polishing SLA 3D-Printed ABS-Like Resins for Surface Roughness and Glossiness Reduction.

Jungyu Son, Hyunseop Lee

|Jul 26, 2020
Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304).

Taekyoung Kim, Hyunseop Lee

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Frequent Collaborators

1 joint publications

Jungyu Son