Yong Chan Hur

1PUBLICATIONS
7CO-AUTHORS
Microelectronics
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Publications (1)

|Jun 21, 2024
Damage-free dry transfer method using stress engineering for high-performance flexible two- and three-dimensional electronics.

Yoonsoo Shin, Seungki Hong, Yong Chan Hur

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Frequent Collaborators

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Yoonsoo Shin

1 joint publications

Seungki Hong

1 joint publications

Chanhyuk Lim

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Kyungsik Do