Xuan-Bach Le
3PUBLICATIONS
4CO-AUTHORS
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Publications (3)
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|Aug 28, 2025
Laser-Based Selective Removal of EMI Shielding Layers in System-in-Package (SiP) Modules.Xuan-Bach Le, Won Yong Choi, Keejun Han
|Nov 27, 2024
Assessment of the Risk of Crack Formation at a Hybrid Bonding Interface Using Numerical Analysis.Xuan-Bach Le, Sung-Hoon Choa
|Mar 29, 2023
Mechanical Reliability Assessment of a Flexible Package Fabricated Using Laser-Assisted Bonding.Xuan-Luc Le, Xuan-Bach Le, Yuhwan Hwangbo
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