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Renlong Liu

6PUBLICATIONS
3CO-AUTHORS
Electrical circuits and systemsPyrometallurgyFunctional materialsMultiphysics flows (incl. multiphase and reacting flows)
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Journal

Publications (6)

Sort by Publication Date:
|May 20, 2024
Electroplated Copper Additives for Advanced Packaging: A Review.

Lanfeng Guo, Shaoping Li, Zhaobo He

|Apr 01, 2024
Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications.

Lanfeng Guo, Renlong Liu, Zhaobo He

|Feb 05, 2024
Recyclable and Efficient Recovery of Ca and S from Phosphogypsum by Using Multistep Precipitation.

Yuqian Zhou, Yuhe Zhou, Renlong Liu

|Dec 18, 2023
Role of Additives: Modified Hemihydrate Phosphogypsum Morphology and Enhanced Filtration Performance of Wet-Process Phosphoric Acid.

Xuejian Huo, Lanfeng Guo, Renlong Liu

|Dec 11, 2023
Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating.

Hu Wei, Tong Tan, Renlong Liu

|Nov 29, 2023
Microwave Reactor with Combined Rigid and Flexible Stirring Paddles for Improving Fluid Heating Uniformity in Soft Manganese Ore Leaching Processes.

Shujin Chen, Shaodou Cen, Renlong Liu

Pageof 1

Frequent Collaborators

1 joint publications

Shujin Chen

1 joint publications

Xuejian Huo

1 joint publications

Facheng Qiu

Frequent Collaborators

1 joint publications

Shujin Chen

1 joint publications

Xuejian Huo

1 joint publications

Facheng Qiu

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