Renlong Liu
6PUBLICATIONS
3CO-AUTHORS
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Publications (6)
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|May 20, 2024
Electroplated Copper Additives for Advanced Packaging: A Review.Lanfeng Guo, Shaoping Li, Zhaobo He
|Apr 01, 2024
Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications.Lanfeng Guo, Renlong Liu, Zhaobo He
|Feb 05, 2024
Recyclable and Efficient Recovery of Ca and S from Phosphogypsum by Using Multistep Precipitation.Yuqian Zhou, Yuhe Zhou, Renlong Liu
|Dec 18, 2023
Role of Additives: Modified Hemihydrate Phosphogypsum Morphology and Enhanced Filtration Performance of Wet-Process Phosphoric Acid.Xuejian Huo, Lanfeng Guo, Renlong Liu
|Dec 11, 2023
Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating.Hu Wei, Tong Tan, Renlong Liu
|Nov 29, 2023
Microwave Reactor with Combined Rigid and Flexible Stirring Paddles for Improving Fluid Heating Uniformity in Soft Manganese Ore Leaching Processes.Shujin Chen, Shaodou Cen, Renlong Liu
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