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Tianyu Zhang

1PUBLICATIONS

2CO-AUTHORS

Electrical circuits and systems

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Publications (1)

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|Feb 27, 2025

Improving thermal expansion coefficients and mechanical properties of interconnect copper by doping Al<sub>2</sub>O<sub>3</sub> nanoparticles: insights from atomistic simulations.

Tianyu Zhang, Yunwen Wu, Shenghong Ju

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Yunwen Wu

1 joint publications

Shenghong Ju

Frequent Collaborators

1 joint publications

Yunwen Wu

1 joint publications

Shenghong Ju

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