Tianyu Zhang

1PUBLICATIONS
2CO-AUTHORS
Electrical circuits and systems
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Publications (1)

|Feb 27, 2025
Improving thermal expansion coefficients and mechanical properties of interconnect copper by doping Al2O3 nanoparticles: insights from atomistic simulations.

Tianyu Zhang, Yunwen Wu, Shenghong Ju

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Frequent Collaborators

1 joint publications

Yunwen Wu

1 joint publications

Shenghong Ju