Transporto Térmico Mediado por Deformación Profunda en Nanohilos de Silicio

Yanchao Li1, Wencong Shi2, Zhentao Pang3

  • 1Center of Acoustic Functional Materials and Applications, School of Materials Science and Intelligent Engineering, Nanjing University, Suzhou 215163, China.

Nano letters
|December 30, 2025
PubMed
Resumen

La deformación elástica profunda (>5%) suprime drásticamente la conductividad térmica de los nanohilos de silicio en un 55%, ofreciendo un nuevo control para nanodispositivos. Esta ingeniería de deformación avanza en la gestión térmica y las aplicaciones termoeléctricas.

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