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Updated: Jan 7, 2026

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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
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Transporto Térmico Mediado por Deformación Profunda en Nanohilos de Silicio
Yanchao Li1, Wencong Shi2, Zhentao Pang3
1Center of Acoustic Functional Materials and Applications, School of Materials Science and Intelligent Engineering, Nanjing University, Suzhou 215163, China.
Nano letters
|December 30, 2025
Resumen
La deformación elástica profunda (>5%) suprime drásticamente la conductividad térmica de los nanohilos de silicio en un 55%, ofreciendo un nuevo control para nanodispositivos. Esta ingeniería de deformación avanza en la gestión térmica y las aplicaciones termoeléctricas.
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