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Updated: Jan 7, 2026

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La ingeniería de la interfaz suprime el autoanillamiento en el cobre nanograno electrolizado para la unión de cobre a

Gangqiang Peng¹, Xinyi Dong^1,2, Binzhao Li³

¹Department of Systems Engineering, City University of Hong Kong, Kowloon, Hong Kong, China.

Advanced science (Weinheim, Baden-Wurttemberg, Germany)

|January 5, 2026

Resumen

No abstract available in PubMed .

Palabras clave:

Enlaces directos de Cu embalaje electrónico avanzado Enlace a baja temperatura Cu con nanopartículas

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