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Deformation occurs in axial and transverse directions when an axial load is applied to a slender bar. This deformation impacts the cubic element within the bar, transforming it into either a rectangular parallelepiped or a rhombus, contingent on its orientation. This transformation process induces shearing strain. Axial loading elicits both shearing and normal strains. Applying an axial load instigates equal normal and shearing stresses on elements oriented at a 45° angle to the load axis.
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Bulk Modulus01:21

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The fineness modulus (FM) of aggregate is a numerical index that measures the coarseness or fineness of the particles. It is calculated by adding the cumulative percentages of aggregate retained on each of a specified series of sieves and dividing the sum by 100.
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The quantity that describes the deformation of a body under stress is known as strain. Strain is given as a fractional change in either length, volume, or geometry under tensile, volume (also known as bulk), or shear stress, respectively, and is a dimensionless quantity. The strain experienced by a body under tensile or compressive stress is called tensile or compressive strain, respectively. In contrast, the strain experienced under bulk stress and shear stress is known as volume and shear...
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Vertical curves provide the transition between two roadway grades, ensuring safety, comfort, and functionality. Calculating elevations at specific stations along the curve involves several systematic steps based on the curve's geometry and provided design parameters.The vertical curve is defined by its length, grades, Point of Vertical Intersection (P.V.I.) location, and P.V.I. elevation. The stations of the Point of Vertical Curvature (P.V.C.), where the curve begins, and the Point of Vertical...
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Sustrato de Módulo Modificado con Interconexiones Verticales Blandas para Sistemas Electrónicos Multicapa

Wenbo Zhao1,2, Yifan Deng1, Binlong Deng3

  • 1Institute of Flexible Electronics, Northwestern Polytechnical University, Xi'an, China.

Advanced materials (Deerfield Beach, Fla.)
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Resumen
Este resumen es generado por máquina.

La electrónica multicapa extensible diseñada supera la desadaptación interfacial para mejorar los dispositivos portátiles y la robótica blanda. Este novedoso diseño logra una deformación del 800% y 4000 ciclos, permitiendo sistemas avanzados de piel electrónica y hápticos.

Palabras clave:
sustratos de módulo modificadoestabilidadextensibilidadsistemas electrónicos multicapa extensiblesinterconexiones verticales

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Área de la Ciencia:

  • Ciencia de los Materiales; Ingeniería Mecánica; Ingeniería Eléctrica

Sus antecedentes:

  • Los sistemas electrónicos multicapa extensibles son cruciales para la electrónica portátil avanzada, la robótica blanda y las interfaces humano-máquina.; La desadaptación mecánica y eléctrica interfacial entre componentes limita la extensibilidad y estabilidad de los sistemas actuales.

Objetivo del estudio:

  • Desarrollar un diseño de sistema electrónico multicapa extensible que supere la desadaptación interfacial para una alta extensibilidad y estabilidad.; Demostrar el rendimiento del sistema en aplicaciones prácticas como la piel electrónica y los sistemas hápticos.

Principales métodos:

  • Combinación de sustrato de módulo modificado con interconexiones blandas verticales.; Utilización de un diseño homólogo de puente blando e isla rígida para reducir la desadaptación del módulo y mejorar la unión interfacial.; Empleo de interconexiones verticales basadas en metal líquido crudo/híbrido para mitigar el efecto Poisson y garantizar conexiones estables.

Principales resultados:

  • Se logró un alto límite de extensibilidad de deformación del 800%.; Se demostró alta estabilidad con más de 4000 ciclos al 100% de deformación.; Superó a los dispositivos electrónicos flexibles multicapa reportados previamente en extensibilidad y estabilidad.

Conclusiones:

  • El diseño del sistema electrónico multicapa desarrollado ofrece mejoras significativas en extensibilidad y estabilidad.; El sistema muestra potencial para aplicaciones en piel electrónica para robots blandos y sistemas hápticos inteligentes integrados con baterías inalámbricas.