Video Experimental Relacionado

Updated: Feb 13, 2026

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
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Published on: April 13, 2016

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Gestión térmica de microelectrónica 3D heterogéneamente integrada: desafíos y direcciones de investigación futuras

Manoj Kumar Sharma1, Bladimir Ramos-Alvarado2

  • 1Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA, 16802, USA. 56mksharma@gmail.com.

Communications engineering
|February 11, 2026
PubMed
Resumen

La integración heterogénea tridimensional (3-DHI) ofrece computación avanzada, pero se enfrenta a desafíos térmicos. Esta revisión explora los cuellos de botella térmicos 3-DHI y evalúa las estrategias de enfriamiento para mejorar el rendimiento y la confiabilidad del dispositivo.

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