BWD-DETR: Un Marco Robusto para la Detección de Defectos en Obleas con Campo Brillante

Optical defect detection based on bright-field imaging is currently one of the most widely applied inspection techniques in wafer fabrication. However, particle defects on the surface of patterned wafers are often small in size. Under bright-field optical imaging conditions, defect signals are easily overwhelmed by complex background textures and noise, seriously affecting the detectability and positioning accuracy of defects. To address this issue, this paper proposes BWD-DETR, a detection framework tailored for wafer surface defects under bright-field imaging. Based on the RT-DETR baseline, this framework integrates a wavelet backbone, an SMFI module, and a CAS-Fusion module, achieving an AP₅₀ of 96.56% and an AP_50:95 of 54.94% in bright-field wafer defect detection, with improvements of 1.64% and 2.17% over the baseline, respectively. The proposed method can effectively enhance the detection capability for sub-micron defects on the wafer surface.