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Updated: Jun 26, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
10:32

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding

Published on: January 9, 2014

格子マッチのシリコン半導体の直帯間隔半導体の計算設計

P Zhang1, V H Crespi, E Chang

  • 1Department of Physics, The Pennsylvania State University, 104 Davey Lab, University Park, Pennsylvania 16802-6300, USA.

Nature
|May 9, 2001
PubMed
まとめ

研究者らは,新しい直帯間隔半導体合金を計算的に設計した. これらの材料はグリッチマッチシリコンであり,統合されたシリコンフォトニクスのための効率的な光放出を可能にします.

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