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Updated: Jun 21, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

フリップチップラミネーションを使用して,シリコンベースの分子電子構造の形成.

Mariona Coll1, Lauren H Miller, Lee J Richter

  • 1Semiconductor Electronics Division, Electronics Electrical Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA. mcollbau@nist.gov

Journal of the American Chemical Society
|August 13, 2009
PubMed
まとめ

研究者は,シリコンに結合された金の上に自己組み立てモノレイヤを使用して分子電子結合を製造しました. この方法は,金属繊維なしで高品質の分子結合を作り,信頼性の高い電気接触を可能にします.

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Types of Semiconductors01:20

Types of Semiconductors

Intrinsic semiconductors are highly pure materials with no impurities. At absolute zero, these semiconductors behave as perfect insulators because all the valence electrons are bound, and the conduction band is empty, disallowing electrical conduction. The Fermi level is a concept used to describe the probability of occupancy of energy levels by electrons at thermal equilibrium. In intrinsic semiconductors, the Fermi level is positioned at the midpoint of the energy gap at absolute zero. When...