オールカーボン分子トンネル・ジャンクション

Haijun Yan¹, Adam Johan Bergren, Richard L McCreery

¹National Institute for Nanotechnology, National Research Council Canada, Edmonton, Alberta, Canada.

Journal of the American Chemical Society

|October 25, 2011

まとめ

金属のない,すべて炭素の分子電子結合は,安定性と性能を向上させます. これらの炭素ベースのデバイスは,分子電子と従来のマイクロエレクトロニクスを統合する有望なことを示しています.

科学分野:

材料科学材料科学とは
ナノテクノロジーナノテクノロジー
電子工学電子工学エンジニアリング

背景:

分子電子は,個々の分子を電子部品として使用することを目的としています.
伝統的な分子結合には,金属接触が用いられることが多いが,金属接触は不安定である.
安定した,高性能の分子結合の開発は,この分野の進歩にとって極めて重要です.

研究の目的:

分子電子結合のための非金属,全炭素コンタクトの使用を調査する.
金属のない分子電子機器を製造し,特徴づけること.
全炭素分子結合の安定性と性能を金属結合と比較して評価する.

主な方法:

カーボン導体間の指向された有機分子を使用して,全炭素分子電子結合の製造.
電流密度-電圧 (J-V) 行動の特徴.
極端なバイアスおよびサイクリング条件下での熱安定性および動作安定性の試験.

主要な成果:

高い製造率 (>90%) と,すべての炭素結合の良好な再現性を達成しました.
完全に炭素製のデバイスは,金属コンタクトに匹敵するJ-V特性を示した.
熱安定性 (最大300°C) と動作安定性 (100°Cで1.2×10^9サイクル) を著しく向上させたことが実証されています.
全炭素結晶は,銅を含む結晶よりも高い電圧と電流密度に耐え,電離と酸化に抵抗しました.

結論:

非金属の全炭素コンタクトは,分子電子結合に優れた安定性と性能を提供します.
炭素材料の強い共振結合は,デバイスの頑丈さに寄与する.
全炭素分子結合は,マイクロエレクトロニクスへの統合の可能性のある重要な進歩を表しています.

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