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Mechanisms of Heat Transfer I01:14

Mechanisms of Heat Transfer I

5.8K
Just as interesting as the effects of heat transfer on a system are the methods by which the heat transfer occur. Whenever there is a temperature difference, heat transfer occurs. It may occur rapidly, such as through a cooking pan, or slowly, such as through the walls of a picnic ice box. So many processes involve heat transfer that it is hard to imagine a situation where no heat transfer occurs. Yet, every heat transfer takes place by only three methods: conduction, convection, and radiation.
5.8K
Mechanisms of Heat Transfer II01:20

Mechanisms of Heat Transfer II

4.5K
In convection, thermal energy is carried by the large-scale flow of matter. Ocean currents and large-scale atmospheric circulation, which result from the buoyancy of warm air and water, transfer hot air from the tropics toward the poles and cold air from the poles toward the tropics. The Earth’s rotation interacts with those flows, causing the observed eastward flow of air in the temperate zones. Convection dominates heat transfer by air, and the amount of available space for the airflow...
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P-N junction01:11

P-N junction

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A p-n junction is formed when p-type and n-type semiconductor materials are joined together. At the interface of the p-n junction, holes from the p-side and electrons from the n-side begin to diffuse into the opposite sides due to the concentration gradient. This diffusion of carriers leads to a region around the junction where there are no free charge carriers, known as the depletion region. The charge density within the depletion region for the n-side and p-side can be described by the...
1.7K
Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

1.4K
The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
1.4K
Biasing of Metal-Semiconductor Junctions01:27

Biasing of Metal-Semiconductor Junctions

907
Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
907
Mechanisms of Heat Transfer01:14

Mechanisms of Heat Transfer

1.9K
Heat transfer between the human body and its environment occurs through four main mechanisms: conduction, convection, radiation, and evaporation.
Conduction, accounting for approximately 3% of body heat loss at rest, is the process of exchanging heat between molecules of two materials in direct contact. This can result in both heat loss and gain. For instance, when the body is submerged in water, which conducts heat 20 times more effectively than air, it can either lose or gain significant...
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Characterization of Thermal Transport in One-dimensional Solid Materials
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Characterization of Thermal Transport in One-dimensional Solid Materials

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原子規模の交差点における熱の散熱

Woochul Lee1, Kyeongtae Kim, Wonho Jeong

  • 1Department of Mechanical Engineering, University of Michigan, Ann Arbor, Michigan 48109, USA.

Nature
|June 15, 2013
PubMed
まとめ
この要約は機械生成です。

研究者は,原子と分子結合における熱の分散を調査した. 彼らは,エネルギー依存の電子伝送が非対称な熱流を引き起こすことを発見し,ナノスケールの熱伝送の理解を進めました.

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High-resolution Thermal Micro-imaging Using Europium Chelate Luminescent Coatings

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High-resolution Thermal Micro-imaging Using Europium Chelate Luminescent Coatings
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High-resolution Thermal Micro-imaging Using Europium Chelate Luminescent Coatings

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Scalable Quantum Integrated Circuits on Superconducting Two-Dimensional Electron Gas Platform
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科学分野:

  • 凝縮物質物理学 凝縮物質物理学
  • ナノテクノロジー ナノテクノロジー
  • 量子トランスポートとは

背景:

  • 原子と単一分子結合は,電気回路の小型化の限界を押し広げています.
  • これらは,ナノスケールデバイスにおける量子輸送理論をテストするためのプラットフォームとして機能します.
  • 電気および熱電気現象は研究されているが,熱散は特徴づけるのに困難である.

研究 の 目的:

  • 単一分子結合の電極における熱分散を調査する.
  • 電子伝送特性と散熱の関係を理解する.
  • 弾性輸送を伴うメソスコピック系における熱分散の枠組みを確立する.

主な方法:

  • 納米スケールの熱電偶が組み込まれているカスタム製のスキャニングプローブを使用しました.
  • 単一分子 ("分子") と数原子 ("原子") の金結合における熱分散を調査した.
  • バイアス極性および電荷キャリアタイプ (電子対穴) に基づく熱分散不対称性を分析した.

主要な成果:

  • エネルギーに依存する伝送特性により,分子結合で非対称な熱分散が生じることを発見した.
  • この非対称性はバイアスの極性と電荷キャリア (電子/穴) に依存していることが観察されました.
  • 弱いエネルギー依存性の原子結合は,有意な非対称性を示さなかった.

結論:

  • 電子伝送の特徴は,原子規模の交差点における熱分散特性と直接相関しています.
  • 弾性輸送によるメソスコピック系における熱分散を理解するための枠組みを確立した.
  • 原子スケールでのペルティエ効果と熱伝送に関する実験的研究への道を開いた.