,

L Wang1, I Meric, P Y Huang

  • 1Department of Electrical Engineering, Columbia University, New York, NY 10027, USA.

Science (New York, N.Y.)
|November 2, 2013
PubMed
まとめ

研究者らは,二次元 (2D) 材料のための新しいエッジコンタクト方法を開発し,高度な電子機器のためのグラフェンヘテロ構造の電気コンタクトを改善しました.

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