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Updated: Feb 12, 2026

Localized Bathless Metal-Composite Plating via Electrostamping
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金属組成とポリエチレニンドーピング能力は,半導体金属酸化物-ポリマー混合物の電荷輸送に及ぼす影響

Wei Huang1,2, Peijun Guo3, Li Zeng4

  • 1Department of Chemistry and the Materials Research Center , Northwestern University , 2145 Sheridan Road , Evanston , Illinois 60208 , United States.

Journal of the American Chemical Society
|April 5, 2018
PubMed
まとめ

ポリエチレニミン (PEI) ドーピングは,無形金属酸化物半導体を強化し,電荷輸送と膜の微細構造を改善します. 最適なドーピングレベルは,金属組成とピークパフォーマンスの比率に依存します.

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