Michael Rein1,2,3, Valentine Dominique Favrod1,4, Chong Hou2,3

  • 1Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.

Nature
|August 10, 2018
PubMed
まとめ

研究者は高品質の半導体ダイオード繊維を作成するために,スケーラブルな熱描画プロセスを開発しました. これらの革新的な繊維は,繊維ベースのコミュニケーションと生理学的モニタリングを可能にし,先進的なスマート繊維の道を開きます.

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