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Updated: Jun 4, 2025

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

12.3K

シリコンのレーザーの直接製造は,チップ製造の問題の解決策を示唆する

Brian Corbett

    Nature
    |January 1, 2025
    PubMed
    まとめ

    No abstract available in PubMed .

    キーワード:
    エンジニアリング材料科学光学とフォトニクス

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