ナノ結晶のクリップ率の高さによるCu-Cu結合インターフェースの強化

Jian-Yuan Huang¹, Dinh-Phuc Tran², Kang-Ping Lee²

¹Institute of Pioneer Semiconductor Innovation, National Yang Ming Chiao Tung University, Hsinchu 300093, Taiwan.

Materials (Basel, Switzerland)

|August 28, 2025

まとめ

ナノ結晶銅 (NC-Cu) は,低温3DIC包装のインターフェイス空隙を大幅に減少させます. その高粒度境界は拡散を高め,Cu-Cu結合の信頼性においてナノツイン銅を上回る.

科学分野:

材料科学
ナノテクノロジー
半導体製造

背景:

3D統合回路 (IC) のパッケージングには,信頼性の高い低温の相互接続が必要です.
表面空隙は,銅-銅 (Cu-Cu) 結合における重要な故障メカニズムである.
先進的な包装技術には,空洞の形成を制御することが不可欠です.

研究の目的:

ナノ結晶銅 (NC-Cu) の低温Cu-Cu結合中の表面空隙を抑制する効果を調査する.
NC-Cuとナノツイン銅 (NT-Cu) の空白特性を量的に比較する.
異なる銅の微細構造における空洞形成と抑制の背後にあるメカニズムを解明する.

主な方法:

ナノ結晶銅 (NC-Cu) の電子沈着は ~89.3 nm の粒径を有する.
~621.8 nmの粒度を持つ (111) 方向ナノツイン銅 (NT-Cu) の製剤である.
200 °Cと250 °Cでの低温Cu-Cu結合
スキャニング・トランスミッション・電子顕微鏡 - 高角環状ダークフィールド (STEM-HAADF) 画像を用いた空白特性の定量分析.

主要な成果:

NC-Cuは200°CでNT-Cu (4.0%) に比べて空白面積比が著しく低かった.
NC-Cuの優れた性能は,原子拡散と移動を促進する高粒度境界密度に起因する.
250 °Cではオストワルドの熟成が起こると,全空白領域分数の増加は,潜在的に残留欠陥による新しい空白核化を示唆した.

結論:

ナノ結晶銅は3DIC包装のための低温Cu-Cu結合において優れた空隙緩和能力を示しています.
NC-Cuの高粒度境界は,低熱予算下で拡散を促進し,空洞形成を抑制する鍵です.
先進的な包装における銅の相互接続の信頼性を最適化するために,空隙核化のメカニズムを理解することは極めて重要です.

キーワード:

3D IC Cu-Cu結合インターフェイスの空白ナノ結晶 Cu プランビューSTEM

さらに関連する動画

08:58

Processing of Bulk Nanocrystalline Metals at the US Army Research Laboratory

Published on: March 7, 2018

9.5K

05:04

Determining the Mechanical Strength of Ultra-Fine-Grained Metals

Published on: November 22, 2021

2.4K

関連する概念動画

01:28

Factors Affecting Creep

214

In normal-weight aggregate concrete, the hardened cement paste is the primary contributor to creep, whereas the aggregates, being stiffer than the cement paste, are more resilient to stress-induced deformation. The stiffness of the aggregates is defined by their modulus of elasticity, and the more voluminous they are in the concrete, the less it will creep.
Further, the water/cement ratio is critical, as a lower ratio increases concrete strength, thus reducing creep. The strength of the...

214

01:25

Effects of Creep

218

Creep in concrete, the gradual deformation under prolonged stress, significantly impacts the integrity of structures. For reinforced concrete beams, it can be a vital design consideration, as it increases deflection, sometimes necessitating additional design measures. In columns, especially slender ones under eccentric loads, creep can cause buckling, compromising their stability. However, creep can be beneficial in indeterminate structures by mitigating stresses that arise from shrinkage,...

218

01:22

Creep in Concrete

449

Creep refers to the time-dependent increase in strain under a sustained load, excluding other time-dependent deformations associated with shrinkage, swelling, and thermal expansion in concrete. The primary mechanism behind creep involves the loss of physically adsorbed water from the calcium silicate hydrate within the hydrated cement paste. This process is further exacerbated by concrete's non-linear stress-strain relationship, microcrack development in the interfacial transition zone, and...

449

02:32

Bonding in Metals

48.0K

Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”.

48.0K

02:37

Metallic Solids

18.7K

Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
All metallic solids exhibit high thermal and electrical conductivity, metallic luster, and malleability....