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Updated: Apr 22, 2026

Metal-silicate Partitioning at High Pressure and Temperature: Experimental Methods and a Protocol to Suppress Highly Siderophile Element Inclusions
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Published on: June 13, 2015

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ホットプレッシングによる高熱伝導性ダイヤモンド・銅複合材料,ターンゲンコーティングによる表面層最適化

Qiang Wang1,2, Zhijie Ye3, Lei Liu1

  • 1School of Aeronautics, Chongqing Jiaotong University, Chongqing 400074, China.

Materials (Basel, Switzerland)
|August 28, 2025
PubMed
まとめ

研究者たちは 電子的な熱管理のために ダイヤモンドと銅の複合材料を改良しました トングステンのインターレイヤーは,熱伝導性を640W/m·Kまで改善し,これはホットプレスシントリングによる50%未満の複合材料の最高値である.

キーワード:
ダイヤモンドと銅の複合材料ホットプレッシングインターフェイスの熱伝導度熱伝導性

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An Available Technique for Preparation of New Cast MnCuNiFeZnAl Alloy with Superior Damping Capacity and High Service Temperature14:51

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