半導体プロセスの無機酸とアンモニアの排出因子
Fu-Yun Chen1, Ming-Peng Yeh1, Sher Ling Lee2
1Environmental Monitoring Center, Green Manufacturing Department, Facility Development Division, Facility, Taiwan Semiconductor Manufacturing Company, Ltd., Taichung 407, Taiwan.
The Science of the total environment
|August 29, 2025
まとめ
半導体製造における無機酸とアンモニアの排出因子は,2020年から2022年にかけての様々な技術ノードで研究されました. アンモニアは主要な排出物で,先進的なプロセスで増加し,酸性排出量は一般的に減少します.
科学分野:
- 環境科学
- 化学工学
- 産業エコロジー
背景:
- 半導体製造は危険な化学物質を使用しており,汚染制御装置からの排出量の評価が必要である.
- 排出因子を理解することは,半導体産業における環境コンプライアンスとプロセスの最適化にとって極めて重要です.
研究 の 目的:
- 2020年から2022年の間に5つの技術ノード (1.2μmから12nmまで) にわたる9つの半導体施設からの無機酸とアンモニアの排出因子を定量化する.
- 製造プロセスの進歩とスクランバーの動作条件に関するこれらの排出因子の動向を分析する.
主な方法:
- 排出因子は,汚染制御後の化学物質使用単位あたりの汚染物質排出量として計算された.
- 様々な技術ノードを代表する9つの半導体製造施設からデータを収集した.
- 傾向と相関を特定するために統計分析が行われました.
主要な成果:
- 塩酸,硫酸,フッ素酸およびアンモニアの排出因子はそれぞれ0.0017,0.0002,0.0017-0.013および0.002 kg/Lであった.
- 特に古い1.2μmノードでは,以前報告された文献値より低いことが判明しました.
- プロセスが進歩するにつれて,無機酸の排出量の一般的な減少傾向が観察され,洗浄水のアンモニアイオン濃度が増加した.
結論:
- アンモニアは半導体製造における主要な排出物であり,その割合はより高度なプロセスで増加しています.
- 非有機酸の排出因子は,技術の進歩とともに減少し,これらの物質の汚染制御効率が向上することを示唆しています.
- 先進的な半導体製造において,アンモニアの排出を制御するためのさらなる研究が必要である.
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