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Updated: Jan 16, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

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レーザーで切った円盤は 超精密のパラシュートになります

Dan Fox

    Nature
    |October 1, 2025
    PubMed
    まとめ

    No abstract available in PubMed .

    キーワード:
    エンジニアリング材料科学テクノロジー

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