ボトムシールドメタル構造によるフレキシブルテキスタイルベース2T1Cピクセル回路の電気的不安定性の安定化

Textile-based displays are emerging as promising candidates for next-generation wearable electronics owing to their conformability and wearability. However, their backplanes suffer from severe electrical instabilities arising from the intrinsic properties of textile substrates. Here, 2T1C pixel circuits were fabricated on textiles through low-temperature processes below 120 °C, exhibiting a representative mobility of ∼8.5 cm² V^-1 s^-1, an on/off ratio of ∼7.0 × 10⁸, and a reliable operation under tensile strain up to 0.87%. Integration with OLEDs confirmed the feasibility of extending textile circuits toward AMOLED implementation. Nevertheless, comprehensive evaluations, including bias stress, breakdown-voltage testing, and temperature-dependent transport, revealed pronounced instabilities arising from substrate deformation, low thermal conductivity, and surface charges. To address these limitations, a bottom shield metal (BSM) structure was introduced as a structural strategy to improve thermal management, electrostatic shielding, and mechanical stability. The BSM suppressed threshold-voltage shifts under positive bias stress, enhanced charge retention, and increased breakdown voltage by over 12 V while also stabilizing pulsed operation. Integration with top-emitting OLEDs further validated the practical applicability of BSM-integrated circuits to textile AMOLEDs. Overall, the application of the BSM structure effectively mitigates the fundamental instabilities of textile backplanes, providing a pathway toward high-performance and reliable textile display systems.