受動アライメントプラットフォーム：光エレクトロニクス、フォトニック、マイクロオプティックシステム用

Large scale integration of chiplet based systems via passive alignment is of great interest for scalable packaging and implementation of current and future photonic and electronic systems. However, nanometer level alignment required for such photonic and electronic systems requires active alignment and makes the packaging process slow and expensive. Here, we present a passive alignment platform for fast, reliable, and scalable assembly of electro-optic systems. We demonstrate 260 nm lateral alignment and 240 nm height alignment between chips with chip-to-chip optical link loss of -2.4 dB. The alignment structures are created on the back of chips at wafer scale and utilize elastic-averaging scheme to create a robust passive alignment platform.