高出力レーザーダイオードアレイにおける液体金属-ダイヤモンド粒子ハイブリッド複合材接合層を用いた熱機械的性能

The beam quality of the high-power laser diode arrays (HPLDAs) is often compromised by the thermomechanical stress resulting from mismatched coefficients of thermal expansion among the packaging materials. In this study, a paste-like liquid metal-diamond particle (LM-DP) hybrid composite is proposed as an alternative bonding layer to traditional solder. Finite element analysis reveals that packaging with the LM-DP layer achieves a nearly uniform stress distribution (stress fluctuation less than 2.62 MPa) and eliminates 99.9% of the interfacial shear stress compared to traditional solder layers under the idealized simulation conditions. Additionally, this packaging method reduces the smile effect under standard operating conditions by approximately 40%. The results indicate that when the diamond particle content reaches 50%, both the chip junction temperature and mechanical stress are minimized. While increasing the bonding layer thickness further may lead to a higher smile effect, this will be alleviated by thermal resistance. This work demonstrates a proof-of-concept simulation and a theoretical feasibility study of applying the paste-like thermal interface materials for low-stress packaging, offering significant potential for improving the beam quality and brightness of HPLDAs.