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    まとめ
    この要約は機械生成です。

    新しいピクセル化欠陥補償方法は、高度な半導体ノード向けの極端紫外線(EUV)リソグラフィを強化します。この効率的なアプローチは、マスク製造可能性を確保しながら、0.55 NAシステムで精度と速度を向上させます。

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    EUVリソグラフィマスク欠陥欠陥補償ピクセル化吸収層半導体製造7nmノード0.55 NA

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