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Updated: Jan 28, 2026

Analysis of Contact Interfaces for Single GaN Nanowire Devices
Published on: November 15, 2013
AlGaN/GaNおよびAlN/GaNヘテロ構造における界面を横断するAl拡散のSIMS調査
Jihed Laifi1, Mohamed Fathy Hasaneen1, Amor Bchetnia2
1Department of Physics, College of Science, Jouf University, Sakaka P.O. Box 2014, Saudi Arabia.
Abstract:
This study investigates Metal-Organic Vapor Phase Epitaxy (MOVPE)-grown AlGaN/GaN and AlN/GaN heterostructures using high-temperature thermal annealing and Secondary Ion Mass Spectrometry (SIMS). By fitting experimental diffusion coefficients (DAl) to the Arrhenius equation, two crucial kinetic parameters were found: the activation energy (Ea) and the pre-factor (D0). In the AlGaN/GaN structure, the dominating out-diffusion of Al has a large D0 = 4.03 × 10-5 cm2 s-1 and a low activation energy in the range of [2.1-2.4 eV]. A substitutional diffusion mechanism in the crystal lattice mediated by defects is closely linked to the low Ea. Significantly higher activation energies (Ea) of 3.66 and 4.59 eV, respectively, control both in- and out-diffusion processes in the AlN/GaN structure. The better intrinsic thermal stability of the pure AlN layer, whose stability is attained by a strong energy barrier, is confirmed by the increase of more than 1.2 eV in Ea.
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