ゲート局所化フッ素化は,強化モードのAlGaN/GaN高電子流動性トランジスタを可能にします
Do Wan Kim1, Byungsoo Kim1, Yongjoo Cho2
1Department of Electrical and Computer Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
まとめ
新しいゲート局所化されたCHF3プラズマプロセスは,ガリウム窒素 (GaN) ベースの高電子移動性トランジスタ (HEMT) を通常オフに可能にします. この方法は,安定した値電圧制御と低ゲート漏れを効率的なパワーエレクトロニクスに提供します.
科学分野:
- マテリアルサイエンス 材料科学
- 半導体デバイスの物理 半導体デバイスの物理
背景:
- ナトリウムガリウム (GaN) ベースの高電子流動性トランジスタ (HEMT) は,高電力および高周波のアプリケーションに不可欠です.
- 機能強化モード (Eモード) の動作は,故障防止行動と減少した待機電力による電源切り替えに望ましい.
- 伝統的なEモード製造方法には,複雑さ,表面損傷,不安定性などの課題があります.
研究 の 目的:
- 通常オフのAlGaN/GaN HEMTsのためのシンプルで安定した製造プロセスを開発する.
- 従来のEモードの強化戦略の限界に対処するために.
主な方法:
- ゲート・ローカライズされたCHF3プラズマプロセスは採用されました.
- このプロセスは,自己制限の穴とフッ素で終わっている表面を作り出しました.
- 表面の劣化を最小限に抑えるために,プラズマ曝露はゲート領域に限定されました.
主要な成果:
- このプロセスは,標準的にAlGaN/GaN HEMTを停止させ,値電圧 (Vth) の安定した正のシフトを可能にしました.
- フッ素の組み込みは,偏振電荷を補正し,水素は欠陥を被動化しました.
- 製造されたデバイスは,バイアス・ストレスの下でゲート漏れが少ない状態で,通常動作が停止していることを示しました.
結論:
- ゲート局所化されたCHF3プラズマプロセスは,EモードのGaN HEMTへの実用的で安定した経路を提供します.
- この方法では,ゲートの深層の掘り下げを避け,製造の複雑性と不安定性を軽減します.
- 開発されたアプローチは,エネルギー効率の良い,高周波,高電力電子システムに適しています.
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