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Updated: Jun 26, 2026

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
10:32

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding

Published on: January 9, 2014

直接带隙半导体的计算设计,该半导体的晶格匹配

P Zhang1, V H Crespi, E Chang

  • 1Department of Physics, The Pennsylvania State University, 104 Davey Lab, University Park, Pennsylvania 16802-6300, USA.

Nature
|May 9, 2001
PubMed
概括

研究人员通过计算设计了新的直带间隙半导体合金. 这些材料与晶格匹配的相匹配,使集成光子学能够有效发射光.

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