terascale .

J D Meindl1, Q Chen, J A Davis

  • 1School of Electrical and Computer Engineering, Microelectronics Research Center, Georgia Institute of Technology, Atlanta, GA 30332-0269, USA. james.meindl@mirc.gatech.edu

Science (New York, N.Y.)
|September 15, 2001
PubMed
概括

半导体技术为 terascale 集成 (TSI) 提供了巨大的潜力,使每个芯片能够实现超过一万亿个晶体管. 实现这一目标需要先进的双门晶体管,并克服未来纳米电子的互连挑战.