基于自组装单层的金属 - 绝缘体 - 金属结合中的分子整顿
Michael L Chabinyc1, Xiaoxi Chen, R Erik Holmlin
1Department of Chemistry and Chemical Biology, Harvard University, 12 Oxford Street, Cambridge, MA 02138, USA.
Journal of the American Chemical Society
|September 26, 2002
概括
这项研究证明了在一个新的电气连接处的电流校正. 由自组装单层形成的金属-绝缘体-金属结合点内的单个氧化还原中心,可以实现这种纠正,而不需要固定双极.
科学领域:
- 材料科学 材料科学 材料科学
- 纳米技术 纳米技术
- 电气工程 电气工程
背景情况:
- 金属-绝缘体-金属接口对于电子设备至关重要.
- 自组装单层 (SAM) 提供了对接口属性的精确控制.
- 电流校正是一种基本的电子功能.
研究的目的:
- 为了研究一种新的金属 - 绝缘体 - 金属连接处的电流整正.
- 探索氧化还原中心在整顿中的作用.
- 为了确定是否需要固定双极来纠正.
主要方法:
- 在银/金和上使用两个不同的自组装单层 (SAM) 制造电气连接点.
- 通过电流-电压测量来表征电气性能.
- 在支持的SAM中,乙醇链长度的系统变化.
主要成果:
- 制造的连接处表现出电流纠正,电导率为9 +/- 2在1V,对于特定的乙醇链长度.
- 校正效率随着乙醇链长度的减少而增加.
- 仅仅由于一个不对称地放置的氧化还原中心,证明了整顿.
结论:
- 一个单一的,不对称地放置的氧化还原中心可以在金属-绝缘体-金属交叉点中诱导电流纠正.
- 在不依赖绝缘层内固定双极的情况下,可以实现校正.
- 这项工作为设计调整分子电子元件提供了新的见解.
相关概念视频
Types of Chemical Bonds
Chemical bonding theories were pioneered by American chemist Gilbert N. Lewis. He developed a model called the Lewis model to explain the type and formation of different bonds. Chemical bonding is central to chemistry; it explains how atoms or ions bond together to form molecules. It explains why some bonds are strong and others are weak, or why one carbon bonds with two oxygens and not three; why water is H2O and not H4O.
Bonding in Metals
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