铜的石脆化是一种原子尺寸效应
Rainer Schweinfest1, Anthony T Paxton, Michael W Finnis
1Atomistic Simulation Centre, Department of Physics and Astronomy, Queen's University Belfast, Belfast BT7 1NN, UK.
Nature
|December 24, 2004
概括
在铜 (Cu) 中微小的 (Bi) 痕迹会通过削弱谷物边界键导致脆性失败. 大的Bi原子将Cu原子推开,解决了关于杂质脆化的一个百年历史的争论.
科学领域:
- 金科学是一种金科学.
- 材料科学是一种材料科学.
- 固态物理 固态物理
背景情况:
- 通过杂质分离到谷物边界的脆化可以导致材料故障.
- 一个多世纪以来,在铜 (Cu) 中 (Bi) 脆化的机制一直在争论中.
研究的目的:
- 为了确定斯木因铜的脆化而导致的机制.
- 解决长期以来关于Cu.中的Bi embrittlement的争论.
主要方法:
- 使用了第一原理量子力学计算.
- 分析重点是将杂质分离到谷物边界.
主要成果:
- 电子对生物微弱的假设被拒绝.
- 支持了一个尺寸效应机制.
- 大的Bi原子被证明通过在粒边界分离Cu原子来削弱原子间的结合.
结论:
- 铜被斯木斯的脆化主要是由于原子尺寸效应,而不是电子相互作用.
- 过大尺寸的杂质原子的分离削弱了粒边界,导致脆碎的断裂.
- 这一发现对了解和预防各种金属合金中的脆化有重要意义.
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