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Fabrication of Ultra-thin Color Films with Highly Absorbing Media Using Oblique Angle Deposition
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陶薄膜:制造和应用.

M Sayer, K Sreenivas

    Science (New York, N.Y.)
    |March 2, 1990
    PubMed
    概括

    新的薄膜方法使复杂的氧化物和电子陶能够与半导体集成. 这通过将材料特性与半导体技术相结合,推进了新型电子设备.

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    科学领域:

    • 材料科学 材料科学 材料科学
    • 固态物理 固态物理
    • 电气工程 电气工程

    背景情况:

    • 陶表现出各种各样的特性,包括极端硬度和独特的电行为.
    • 传统陶在与现代电子系统集成方面存在局限性.

    研究的目的:

    • 探索创建复杂氧化物和电子陶薄膜的新方法.
    • 研究这些陶特性与半导体技术的整合.
    • 为了使新一代电子设备的发展成为可能.

    主要方法:

    • 开发先进的薄膜沉积技术.
    • 陶薄膜的结构和电气性能的表征.
    • 制造和测试集成陶和半导体元件的原型电子设备.

    主要成果:

    • 成功合成复杂氧化物和电子陶的高质量薄膜.
    • 在制造的陶薄膜中展示可调节的电气性能.
    • 陶薄膜与基于的半导体平台的整合.

    结论:

    • 新的薄膜制造方法对于电子陶的发展至关重要.
    • 电子陶与半导体的整合为新型设备功能开辟了道路.
    • 这项研究为下一代具有增强性能的电子设备铺平了道路.

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