聚合物门介电表面的粘弹性调节五晶体管的性能
Choongik Kim1, Antonio Facchetti, Tobin J Marks
1Department of Chemistry and the Materials Research Center, Northwestern University, 2145 Sheridan Road, Evanston, IL 60208, USA.
Science (New York, N.Y.)
|October 6, 2007
概括
聚合物薄膜在受限时显示较低的玻璃过渡温度 (Tg). 这些聚合物上的五烯薄膜揭示了与介电体相关的明显过渡和性能变化.
科学领域:
- 材料科学 材料科学 材料科学
- 聚合物科学 聚合物科学
- 有机电子 有机电子
背景情况:
- 与散装材料相比,纳米限制的聚合物薄膜具有显著低的玻璃过渡温度 (Tg).
- 有机薄膜晶体管 (OTFT) 的行为受到底层聚合物介电的特性的影响.
- 了解有机半导体和聚合物介电材料之间的接口对于设备性能至关重要.
研究的目的:
- 为了研究聚合物介电粘弹性对五烯薄膜形态,微观结构和晶体管性能的影响.
- 为了确定转变发生的特定生长温度,并将它们与介电链的移动性相关联.
- 突出埋葬接口效应在优化有机薄膜晶体管 (OTFT) 设计中的重要性.
主要方法:
- 聚合物门介电材料上,在受控温度下,在散装Tg.以下,太烯薄膜的生长.
- 使用先进技术对膜形态和微观结构的表征.
- 有机薄膜晶体管 (OTFT) 的制造和电气特性,以评估性能.
- 分析电流电压响应以检测接口粘弹性效应.
主要成果:
- 在聚合物介电材料上生长的五烯膜在特定的生长温度下表现出突然的形态和微观结构过渡.
- 这些转变与聚合物介电体进入其状状态相关,表明链的流动性增加.
- 有机薄膜晶体管 (OTFT) 的性能在这些过渡温度下显示出明显的不连续性,而不依赖于介电厚度.
- 埋葬接口粘弹性效应可以通过分析电流电压响应来检测.
结论:
- 聚合物介电的粘弹性状态显著影响了覆盖的五烯薄膜的特性和OTFT性能.
- 有机电子设备的优化需要仔细考虑基本的埋面接口粘弹性.
- 这种效应为调整和增强有机薄膜晶体管的性能提供了新的途径.
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