环应变在单分子电路中创建高导电路径.
Timothy A Su1, Jonathan R Widawsky, Haixing Li
1Department of Chemistry, Columbia University , New York, New York 10027, United States.
Journal of the American Chemical Society
|November 23, 2013
概括
紧张的西兰直接合到金电极,创建分子电线,作为平行电路. 研究人员可以通过改变环境或电极距离来控制导电性,从而实现新的基于的单分子电子.
科学领域:
- 分子电子学分子电子学
- 纳米技术纳米技术
- 表面化学 表面化学
背景情况:
- 单分子电子技术为小型化设备提供了潜力.
- 控制分子结点中的电荷运输通路至关重要.
- 基于的分子电线具有显著的兴趣.
研究的目的:
- 为了证明压力西兰与黄金电极的直接合.
- 为了研究分子电线中的竞争导电通路.
- 建立用于控制单分子连接的导电性的方法.
主要方法:
- 在金电极上测量压力轮的断路导电性.
- 使用硫化的硫化为分子电线的终结.
- 环境操纵来改变电极表面合.
- 调节尖端-基板电极距离以切换路径.
主要成果:
- 紧张的西兰首次直接合到金电极上.
- 分子电线呈现平行电路,具有明显的低电导率 (硫至硫) 和高电导率 (硫至) 路径.
- 通过禁用Au-silacycle合,可以关闭高导电性轮路径.
- 导电路径可以通过调整电极距离来调节.
结论:
- 紧张的西兰为单分子电子提供了一种新的分子设计.
- 环境控制和电极距离调制允许路径切换.
- 这项工作为开发可控制的基于的单分子电线开辟了道路.
相关概念视频
Semiconductors
1.9K
There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...
1.9K
Types of Semiconductors
1.8K
Intrinsic semiconductors are highly pure materials with no impurities. At absolute zero, these semiconductors behave as perfect insulators because all the valence electrons are bound, and the conduction band is empty, disallowing electrical conduction. The Fermi level is a concept used to describe the probability of occupancy of energy levels by electrons at thermal equilibrium. In intrinsic semiconductors, the Fermi level is positioned at the midpoint of the energy gap at absolute zero. When...
1.8K
Biasing of Metal-Semiconductor Junctions
919
Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
919
Metal-Semiconductor Junctions
1.4K
The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
1.4K
Design Example: Strain Gauge Bridge or Wheatstone Bridge
1.3K
The utilization of strain gauges as transducers for converting mechanical strain into electrical signals is a common practice in various engineering applications. These strain gauges are frequently integrated into Wheatstone bridge circuits to accurately measure parameters such as force or pressure. Within this context, each element within the circuit exhibits a resistance that undergoes subtle variations when subjected to mechanical strain. The primary objective is to convert minuscule...
1.3K


