高热稳定性的解决方案可加工的窄带间隙分子半导体.
Xiaofeng Liu1, Ben B Y Hsu, Yanming Sun
1Center for Polymers and Organic Solids and Department of Chemistry and Biochemistry and ‡Department of Physics, University of California , Santa Barbara, California 93106, United States.
Journal of the American Chemical Society
|October 28, 2014
概括
增加联分子中的增加了它们的热稳定性和在电子设备中的性能. 这种分子设计对于在各种条件下运行的强大的光电子应用程序的开发至关重要.
科学领域:
- 材料科学 材料科学 材料科学
- 有机电子 有机电子
- 聚合物化学 聚合物化学
背景情况:
- 结合分子是有机电子学中的关键组成部分.
- 热稳定性是设备寿命和性能的一个关键因素.
- 化是一种已知的调整分子性质的策略.
研究的目的:
- 研究替代模式对结合分子的散热稳定性的影响.
- 为了评估化分子在场效应晶体管设备中的性能和热强度.
主要方法:
- 窄带间隙结合分子的合成,具有不同的替代.
- 热分析以评估散热稳定性和相位过渡温度.
- 包括这些分子的场效应晶体管的制造和表征.
主要成果:
- 增加的替代导致了在惰性和环境条件下增强的散热稳定性.
- 更高的含量增加了固态相位过渡温度.
- 最富含的分子表现出0.15cm2/V·s的孔移动性和超过300°C的装置热稳定性.
- 提高了热强度和设备性能,与C-H到C-F替代的程度相关联.
结论:
- 化是一种提高分子半导体热稳定的有效策略.
- 具有特定模式的分子设计对于创建高性能,耐用的光电子设备至关重要.
- 这些发现为开发适用于苛刻操作环境的材料提供了途径.
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