在芯片上和独立的弹性碳薄膜用于微型超级电容器
P Huang1, C Lethien2, S Pinaud3
1Université Paul Sabatier-Toulouse III, Laboratoire Centre Inter-universitaire de Recherche et d'Ingénierie des Matériaux (CIRIMAT), UMR CNRS 5085, 118 route de Narbonne, 31062 Toulouse, France. Réseau sur le Stockage Electrochimique de l'Energie, FR CNRS n°3459, France.
概括
我们开发了一种晶圆尺度的工艺,用于芯片上的微型超级电容, 这一突破使得基于的电子产品能够集成储能,
科学领域:
- 材料科学
- 电气工程
- 纳米技术
背景情况:
- 整合储能与电子很困难.
- 现有的方法限制了芯片上的储能能力.
研究的目的:
- 创建微型超级电容器的晶圆规模制造工艺.
- 开发与微制造相容的材料.
主要方法:
- 碳化物衍生碳膜的制造
- 集成的碳化电流收集器.
- 晶圆尺度处理与技术兼容.
主要成果:
- 达到高容量:410 F/cm3 (水性) 和170 F/cm3 (有机).
- 开发出机械稳定的多孔碳膜 (Young 的模量为 14.5 GPa).
- 证明与基于的设备技术的兼容性.
结论:
- 开发的过程可以实现芯片内储能集成.
- 材料显示了结构性储能和灵活电子的潜力.
- 这项工作促进了集成系统的微型超级电容技术的发展.
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