将光子与纳米电子集成为下一代芯片系统
Amir H Atabaki1, Sajjad Moazeni2, Fabio Pavanello3,4,5
1Massachusetts Institute of Technology, Cambridge, MA, USA. atabaki@mit.edu.
Nature
|April 20, 2018
概括
这项研究将光子与散装互补金属氧化物半导体 (CMOS) 芯片集成,使单一芯片上的高速光学收发器成为可能. 这项创新解决了数据中心和计算中的高带宽光学互连的需求.
科学领域:
- 光学和纳米电子的整合.
- 光子和补充金属氧化物半导体 (CMOS) 技术.
背景情况:
- 目前的纳米技术在整合光子功能方面面临限制,原因是大量的基板.
- 未来的需求需要通过综合解决方案利用电子和光子技术的互补物理.
研究的目的:
- 在大量的CMOS芯片中引入光子.
- 开发用于高带宽光学互连的高速光学收发器.
主要方法:
- 在65纳米晶体管CMOS过程中,在晶体管旁边的氧化岛上沉积了一层多晶体.
- 在这个层上制造了光学波导,共振器,光学调制器和雪崩光探测器.
- 在一个直径为300毫米的微电子造厂内集成光子平台.
主要成果:
- 成功实现了光学波导,共振器,高速光学调制器和雪崩光探测器.
- 实现了以每秒10千兆的速度运行的集成光学收发器.
- 在使用数百万个晶体管的单个光学总线上演示波长分割多重.
结论:
- 这种集成方法将光子设备的形成与晶体管的形成分离,实现系统在芯片上的性能和可扩展性.
- 开发的平台为融合光子与最先进的纳米电子提供了途径.
- 这项技术解决了数据中心和高性能计算中的高带宽光学互连的需求.
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