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相关概念视频

Network Covalent Solids02:18

Network Covalent Solids

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Network covalent solids contain a three-dimensional network of covalently bonded atoms as found in the crystal structures of nonmetals like diamond, graphite, silicon, and some covalent compounds, such as silicon dioxide (sand) and silicon carbide (carborundum, the abrasive on sandpaper). Many minerals have networks of covalent bonds.
To break or to melt a covalent network solid, covalent bonds must be broken. Because covalent bonds are relatively strong, covalent network solids are typically...
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石墨烯和用于技术的二维材料

Deji Akinwande1, Cedric Huyghebaert2, Ching-Hua Wang3

  • 1Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, TX, USA. deji@ece.utexas.edu.

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与芯片集成的二维 (2D) 材料可以提高电子设备的性能. 这种异构的平台利用3D单体结构来实现先进的光电子和传感应用.

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科学领域:

  • 材料科学
  • 电子工程
  • 纳米技术

背景情况:

  • 半导体技术通过将设备缩小到纳米尺度推动了电子技术的发展.
  • 石墨烯和其他二维材料为原子极限装置的性能提供了机会.
  • 通过将二维材料与结合, 创造了一个多元化的平台, 以提高功能.

研究的目的:

  • 审查原子薄材料与基于的纳米系统的整合.
  • 探索这一领域的机遇,进步和挑战.
  • 考虑计算和非计算应用的前景.

主要方法:

  • 多功能二维芯片的三维单体结构.
  • 使用垂直尺寸来提高性能.
  • 平台的功能多样化

主要成果:

  • 两维材料和芯片的协同作用可以大大提高潜力.
  • 三维集成可以利用垂直方向和功能多样化.
  • 在光电子和传感领域的应用得到了便利.

结论:

  • 整合二维材料与为下一代电子设备提供了途径.
  • 不同质的平台有望超越传统的扩展.
  • 需要进一步的研究来克服整合的挑战,并充分发挥潜力.