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A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

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石墨烯和用于技术的二维材料

Deji Akinwande¹, Cedric Huyghebaert², Ching-Hua Wang³

¹Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, TX, USA. deji@ece.utexas.edu.

|September 27, 2019

概括

与芯片集成的二维 (2D) 材料可以提高电子设备的性能. 这种异构的平台利用3D单体结构来实现先进的光电子和传感应用.

科学领域:

材料科学
电子工程
纳米技术

背景情况:

半导体技术通过将设备缩小到纳米尺度推动了电子技术的发展.
石墨烯和其他二维材料为原子极限装置的性能提供了机会.
通过将二维材料与结合, 创造了一个多元化的平台, 以提高功能.

研究的目的:

审查原子薄材料与基于的纳米系统的整合.
探索这一领域的机遇,进步和挑战.
考虑计算和非计算应用的前景.

主要方法:

多功能二维芯片的三维单体结构.
使用垂直尺寸来提高性能.
平台的功能多样化

主要成果:

两维材料和芯片的协同作用可以大大提高潜力.
三维集成可以利用垂直方向和功能多样化.
在光电子和传感领域的应用得到了便利.

结论:

整合二维材料与为下一代电子设备提供了途径.
不同质的平台有望超越传统的扩展.
需要进一步的研究来克服整合的挑战,并充分发挥潜力.

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