了解原子层沉积中非理想性的电子缺陷抑制机制
Mahmut Sami Kavrik1, Aaron Bostwick2, Eli Rotenberg2
1Materials Science and Engineering , University of California San Diego , La Jolla , California 92093 , United States.
Journal of the American Chemical Society
|November 30, 2019
概括
这项研究通过在原子层沉积 (ALD) 过程中使用周期性臭氧暴露来证明一种减少 (SiGe) 电子设备缺陷的新方法. 这种技术显著提高了基于SiGe的量子计算和神经形态应用的性能.
科学领域:
- 材料科学
- 半导体物理
- 纳米技术
背景情况:
- 对量子计算机和晶体管等先进电子设备至关重要.
- 表面状态和SiGe-氧化物接口的电荷陷,由GeO2形成造成,阻碍了设备的性能.
- 传统的原子层沉积 (ALD) 难以防止GeO2的形成,导致界面缺陷.
研究的目的:
- 研究和利用非理想的ALD中的扩散过程,使SiGe的界面缺陷变得无源.
- 展示在氧化物沉积过程中抑制电荷陷的方法.
- 为了减少 SiGe 装置中带间隙的集成陷密度 (Dit).
主要方法:
- 在SiGe的Al2O3和HfO2的ALD过程中使用周期性臭氧暴露作为二次氧化剂.
- 在非理想的ALD过程中通过门氧化物进行反应物种扩散的研究.
- 使用扫描传输电子能量损失光谱 (STEM-EELS) 来确认Ge耗尽和SiO2丰富的接口形成.
主要成果:
- 在Al2O3 (<6 × 10^10 cm^-2) 和HfO2 (<3.9 × 10^11 cm^-2) 门介电器中,整合陷密度 (Dit) 降低了近一个数量级.
- 通过从接口层中消耗Ge,在SiGe上形成一个富含SiO2的接口.
- 使用STEM-EELS确认了O2的形成和脱落,并确定了缺陷减少机制.
结论:
- 在ALD期间定期暴露于臭氧,通过促进SiO2丰富的接口,有效地抑制SiGe的接口缺陷.
- 在非理想的ALD过程中,工程扩散物种为缺陷抑制提供了可行的纳米尺度机制.
- 这种方法增强了SiGe在高性能电子和量子计算应用中的潜力.
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