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多晶分子半导体膜的工程内在灵活性

Dan Zhao^1,2, Jianhua Chen^1,3, Binghao Wang¹

¹Department of Chemistry and the Materials Research Center, Northwestern University, 2145 Sheridan Road, Evanston, Illinois 60208, United States.

Journal of the American Chemical Society

|February 14, 2020

概括

通过使用一种新的塑化方法,制造出由烯胺 (PDIF-CN2) 制成的柔性半导体薄膜. 这种方法提高了电子设备的机械灵活性和充电传输特性.

科学领域:

材料科学
有机电子
聚合物科学

背景情况:

开发灵活的有机半导体对于下一代电子设备至关重要.
二胺 (PDIF) 是有前途的n型有机半导体,但往往缺乏机械灵活性.
在不损害电荷传输性能的情况下实现灵活的薄膜仍然是一个挑战.

研究的目的:

开发核心化胺 (PDIF-CN2) 分子半导体的机械灵活薄膜.
使用专门设计的聚合物粘合剂 (PB) 研究一种新的谷物边界塑化策略.
评估由此产生的混合膜的机械稳定性和电荷传输性能.

主要方法:

合成了一种新型的聚合物粘合剂 (PB) 带有二胺-二烯 π-结合骨干,并与 PDI 单元功能化.
通过将PDIF-CN2与新型PB混合,开发了一种谷物边界塑化策略.
描述了混合膜的形态和机械灵活性,包括曲测试.
使用PB/PDIF-CN2混合膜制造了薄膜晶体管 (TFT),并测量了它们的电子流动性.

主要成果:

通过颗粒边界塑化实现PDIF-CN2的机械柔性薄膜.
混合薄膜呈现同质形态,类似于纯 PDIF-CN2 薄膜,在曲至 2 毫米的半径时保持这种结构.
使用PB/PDIF-CN2混合物制造的薄膜晶体管即使经过多次曲也显示出相当大的电子流动性.
新型PB有效地将PDIF-CN2结晶体连接到粒边界,防止相分离.

结论:

谷物边界塑化策略成功地产生了具有出色机械和电荷传输性能的柔性PDIF-CN2薄膜.
这种方法为创建有纹理的,灵活的半导体π电子膜提供了新的途径.
开发的聚合物粘合剂有效提高分子半导体薄膜的机械强度.

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