Chao Xiang1, Junqiu Liu2, Joel Guo1

  • 1Department of Electrical and Computer Engineering, University of California, Santa Barbara, Santa Barbara, CA 93106, USA.

Science (New York, N.Y.)
|July 2, 2021
PubMed
概括

我们使用InP/Si激光器和Si3N4微振电器开发了集成光子激光微. 这使得基于芯片的频率可以大规模生产用于高容量通信系统.