超薄的HfO2-ZrO2超级网格门堆用于先进的晶体管
Suraj S Cheema1, Nirmaan Shanker2, Li-Chen Wang3
1Department of Materials Science and Engineering, University of California, Berkeley, Berkeley, CA, USA. s.cheema@berkeley.edu.
Nature
|April 7, 2022
概括
研究人员为先进的晶体管开发了新的超薄HfO2-ZrO2超级网格异构结构. 这些新的门堆提供了更好的电容和更低的泄漏电流,而不会降低电子的移动性.
科学领域:
- 材料科学
- 固态物理
- 纳米技术
背景情况:
- 晶体管侧面尺寸的缩放需要增加门容量,以改善门控制和降低操作电压.
- 自2008年以来,二氧化 (HfO2) 已成为门的标准高压电常量材料.
- 传统的HfO2门需要接口SiO2清理,这会对电子传输产生负面影响,并增加门泄漏.
研究的目的:
- 引入HfO2-ZrO2超网格异构结构作为新型门堆材料.
- 为了实现超薄的氧化物层,增强容量和减少泄漏电流.
- 克服传统的HfO2基门堆的局限性.
主要方法:
- 直接集成到晶体管上的HfO2-ZrO2超晶体结构的制造.
- 在异构结构中稳定混合铁电-反铁电秩序.
- 将门氧化物的厚度缩小到大约20安格斯特罗姆.
主要成果:
- 在金属氧化物半导体电容器中达到相当于6.5安格斯特罗姆的氧化物厚度.
- 与传统的HfO2门堆相比,泄漏电流明显较低.
- 不同于涉及界面SiO2清理的方法,没有观察到移动性降解.
结论:
- 通过竞争的铁电-抗铁电顺序稳定的超薄铁HfO2-ZrO2多层为传统的HfO2门提供了有前途的替代方案.
- 这种方法使得电子设备中的先进氧化物堆能够超越当前的材料限制.
- 开发的异构结构为下一代高性能晶体管提供了途径.
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