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Updated: Aug 24, 2025

Rapid Acquisition of 3D Images Using High-resolution Episcopic Microscopy
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集成成像传感器用于对偏差进行校正的3D摄影

Jiamin Wu1,2,3, Yuduo Guo4,5, Chao Deng1,3

  • 1Department of Automation, Tsinghua University, Beijing, China.

Nature
|October 19, 2022
PubMed
概括

这项研究引入了一种新型的超成像传感器,用于高速的偏差校正3D摄影. 这项技术可实现千兆像素成像和精确的深度映射,降低成本并提高各种应用的性能.

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