通过 DFT 指导的连接体设计实现室温催化化
Seoung-Tae Kim1, Michael J Strauss1, Albert Cabré1
1Department of Chemistry, Massachusetts Institute of Technology, 77 Massachusetts Ave., Cambridge, Massachusetts 02139, United States.
Journal of the American Chemical Society
|March 17, 2023
概括
新的阳离子N1,N2-二-1,2-联体使温和的室温铜催化C-N合反应成为可能. 这些配体提高了反应速率,并扩大了包括复杂药物在内的基和胺的基质范围.
科学领域:
- 有机金属化学
- 催化剂
- 有机合成
背景情况:
- 乌尔曼型C-N合反应提供了替代催化方法,使用更便宜的铜.
- 现有的铜联体设计通常需要严苛的条件,限制其与复杂分子的应用.
- 阳离子配体已经显示出有前途,但需要进一步开发以获得更广泛的实用性.
研究的目的:
- 开发用于铜催化C-N合反应的新联体.
- 为了实现温和的反应条件,包括室温操作.
- 扩大基质的范围,特别是复杂的化和胺.
主要方法:
- 阳离子N1,N2-二甲-1,2-二联体的设计和合成.
- 甲基化物与各种胺的铜催化氨化反应.
- 密度功能理论 (DFT) 计算以指导配体设计和理解反应机制.
- 优化反应条件以达到温和性和效率.
主要成果:
- 在温和条件下促进有效的Cu-催化氨基化的阳离子N1,N2-二甲-1,2-二联体的开发.
- 在室温下成功合多种烯/异烯和胺,包括功能化药物.
- DFT计算显示连接物增加铜的电子密度,并稳定活性Cu (I) 物种.
- 由于氧化添加能障碍较低,用纳基残留物进行基基修饰导致了30倍的速率增加.
结论:
- 已经建立了一个用于铜催化C-N合的新类离子配体.
- 这些配体促进了温和高效的C-N键形成,扩大了乌尔曼型反应的范围.
- 开发的方法适用于复杂的基质,并有可能用于其他铜催化交叉合反应.
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