一个单面微加工的MPa级高温压力传感器
Peng Li1,2, Wei Li2,3, Changnan Chen2,3
1State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
Micromachines
|May 27, 2023
概括
这项研究引入了一种新型的压电阻高温绝对压力传感器,使用混合在绝缘体晶圆. 微小的0.5x0.5毫米传感器在广泛的温度范围内实现了高精度,从而实现了先进的工业应用.
科学领域:
- 材料科学 材料科学 材料科学
- 传感器技术 传感器技术
- 半导体设备 半导体设备
背景情况:
- 传统的高温压力传感器经常面临尺寸,成本和制造复杂性的挑战.
- 在传感器应用中,在绝缘体 (SOI) 技术提供了小型化和性能增强的潜力.
研究的目的:
- 开发一个高温绝对压力传感器,具有紧的外形和简化的制造工艺.
- 为了利用混合 (100) / 111) SOI晶片来提高压电阻的性能和集成的隔膜/腔结构.
主要方法:
- 使用 (100) 用于高性能压电阻和 (111) 用于隔膜和参考腔的单面制造.
- 采用前侧浅干蚀刻和自动停止侧湿蚀刻,用于精确控制隔膜厚度和内腔嵌入.
- 在没有双面蚀刻,晶圆粘合或专门的空腔-SOI制造的情况下实现了0.5x0.5mm的小型化.
主要成果:
- 1.5 MPa范围传感器在室温下显示了59.55 mV/1500 kPa/3.3 VDC的全尺度输出.
- 在-55°C至350°C的温度范围内实现了0.17%FS的高整体精度.
- 报告的低热歇斯底里斯在350°C时约为0.15%FS.
结论:
- 开发的压电阻传感器为高温压力传感提供了一种具有成本效益和高产量的解决方案.
- 传感器的紧尺寸和强大的性能使其适用于苛刻的工业自动化和风洞测试应用.
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