在静态随机存取内存中的性能降低10纳米节点FinFET由于位移缺陷导致的性能降低
Minji Bang1, Jonghyeon Ha1, Gyeongyeop Lee1
1Department of Electrical Engineering, Gyeongsang National University, Jinju 52828, Gyeongnam, Republic of Korea.
Micromachines
|May 27, 2023
概括
10nm FinFET 6T SRAM 的位移缺陷降低了性能. 减少翅膀宽度和增加翅膀高度通过优化电流和噪声边际来提高辐射硬度.
科学领域:
- 半导体设备物理学 半导体设备物理
- 集成电路可靠性 集成电路可靠性
背景情况:
- 静态随机访问存储器 (SRAM) 对于现代电子设备至关重要.
- 微波场效应晶体管 (FinFET) 是先进集成电路中的关键组件.
- 了解缺陷引起的变化对于设备可靠性至关重要.
研究的目的:
- 调查10纳米节点FinFET 6T SRAM中的位移缺陷引起的电流和静态噪声边缘变化.
- 分析各种缺陷集群条件和结构对SRAM性能的影响.
- 为了确定最佳的FinFET结构,以提高辐射硬度.
主要方法:
- 技术计算机辅助设计 (TCAD) 模拟被使用.
- 基于10nm节点FinFET的六晶体管 (6T) SRAM的分析.
- 模拟了缺陷集群形状 (例如,矩形) 和尺寸 (宽度,高度) 的变化.
主要成果:
- 矩形缺陷集群通过在顶捕获更多电荷来减少开启和关闭电流.
- 阅读静态噪声边际 (RSNM) 在阅读操作期间在拉下晶体管中受到影响最大.
- 增加翅膀宽度降低了RSNM由于门场效应.
- 翅膀高度的降低增加了每截面面积的电流,并降低了类似的能量屏障.
结论:
- 减少翅膀宽度和增加翅膀高度对10纳米节点FinFET 6T SRAMs是有益的.
- 这些结构修改通过优化缺陷条件下的性能来提高辐射硬度.
- 该研究提供了关于缓解先进SRAM技术中缺陷诱导的变异的见解.
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