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材料寻求集成电路中先进的互连金属化
Jun Hwan Moon1, Eunjin Jeong1, Seunghyun Kim1
1Department of Materials Science and Engineering, Korea University, Seoul, 02841, Republic of Korea.
Advanced science (Weinheim, Baden-Wurttemberg, Germany)
|June 15, 2023
概括
随着尺寸的缩小,先进的互连金属化对于集成电路 (IC) 性能至关重要. 本综述探讨了纳米级互连的新材料,以克服后端线 (BEOL) 的挑战.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体制造业 半导体制造业
背景情况:
- 集成电路 (IC) 的性能改进由于成本和复杂性增加而放缓.
- 后端线路 (BEOL) 流程落后于前端线路 (FEOL) 的发展.
- 随着晶体管密度的增加,芯片速度现在受到互连性能的限制.
研究的目的:
- 在先进的集成电路中审查纳米级互连的新材料.
- 为了应对相互连接结构中物理尺寸缩小所带来的挑战.
- 为了弥合学术研究和工业应用之间的差距,在互连材料中.
主要方法:
- 探索收缩的互连结构中的挑战.
- 对材料特性进行分析,以解决相互连接中的问题.
- 对材料特性和工艺应用的最新研究进行审查.
主要成果:
- 识别新的屏障材料:二维材料,自组装分子层,高合金.
- 引入了新的导体材料: (Co), (Ru),金属间化合物,MAX相.
- 从理论计算到实践过程集成,对材料特性进行全面的讨论.
结论:
- 新材料对于克服规模化IC的互连限制至关重要.
- 为实施先进的互连解决方案,提出了基于材料的战略.
- 该审查为行业采用新型互连材料提供了路线图.
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