Jun Hwan Moon1, Eunjin Jeong1, Seunghyun Kim1

  • 1Department of Materials Science and Engineering, Korea University, Seoul, 02841, Republic of Korea.

概括

随着尺寸的缩小,先进的互连金属化对于集成电路 (IC) 性能至关重要. 本综述探讨了纳米级互连的新材料,以克服后端线 (BEOL) 的挑战.